Socket including pressure conductive rubber and mesh for testing of ball grid array package
US6489790B1 · kind B1 · utility
18Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Mar 7, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0483
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A socket for testing a BGA package capable of avoiding problems like deformation of external terminals of the BGA package or failing to detect a defective BGA package and a test method using the socket are provided. The socket for testing a BGA package connects solder balls (or solder bumps) as external terminals of the BGA package via a mesh, a pressure conductive rubber (PCR) as a middle connection unit, and a channel connection means of a socket board. A plane board having POGO pins or a printed circuit pattern can be used for the channel connection means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.