Interconnection of circuit substrates on different planes in electronic module
US6490168B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1999 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Sep 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09118
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44). During a solder screening process a solder paste is applied to the opening (56) of the second circuit substrate (44), and during a solder reflow operation the solder paste melts and a connection is formed between the first circuit substrate (40) and the second circuit substrate (44).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.