Multi-link segmentation and reassembly for bonding multiple PVC's in an inverse multiplexing arrangement
US6490296B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2001 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Oct 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2012/5672
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Systems and methods are described for multi-link segmentation and reassembly for bonging multiple virtual circuits in an inverse multiplexing arrangement. A method includes: generating a plurality of multilink segmentation and reassembly sublayer cells at a first location; distributing the plurality of multilink segmentation and reassembly sublayer cells across a plurality of virtual circuits; transmitting the plurality of multilink segmentation and reassembly sublayer cells to a second location via the plurality of virtual circuits; and receiving the plurality of multilink segmentation and reassembly sublayer cells at the second location. An apparatus includes a multilink segmentation and reassembly sublayer transmitter, including: a source buffer; a multilink controller coupled to the source buffer; and a plurality of virtual circuits coupled to the multilink controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.