Automatic electronic component-mounting apparatus
US6490784B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2000 |
| Grant date | Dec 10, 2002 |
| Priority date | — |
| Expiry date | Jan 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An automatic electronic component-mounting apparatus is provided. A nut member is slidably arranged between a pair of rails. A head-lifting/lowering member is lowered and lifted with respect to the main block via the pair of rails and the nut member. A mounting head is attached to the head-lifting/lowering member. The head-lifting/lowering member is lowered and lifted to cause the mounting head to pick up an electronic chip component and then mount the electronic chip component on a printed circuit board. The head-lifting/lowering member is formed of a metal-ceramic composite material produced by combining a ceramic reinforcing material with a metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.