Polymers and photoresist compositions comprising same
US6492087B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 18, 2000 |
| Grant date | Dec 10, 2002 |
| Priority date | — |
| Expiry date | Feb 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a first aspect, polymers of the invention in general comprise a photoacid-labile unit that can generate multiple anions or acidic groups such as hydroxy (particularly phenolic) preferably from a single photoacid-induced polymer deprotection reaction. In a further aspect, polymers of the invention comprise a photoacid-labile unit that generate substantially or essentially no volatile species species during a photoacid-induced deprotection reaction of the polymer to thereby avoid undesired outgassing and/or shrinkage of a resist coating layer containing a polymer of the invention. In particularly preferred aspects of the invention, polymers are provided that combine both aspects, i.e. the polymers contain blocking groups that can generate multiple anions or acid groups preferably from a single photoacid-induced polymer deprotection reaction, and those blocking groups also generate substantially no volatile species during microlithographic processing. Polymers of the invention are particularly useful as components of photoresist compositions, particularly chemically-amplified positive resists.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.