Electronic device and a method of manufacturing the same
US6492737B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2001 |
| Grant date | Dec 10, 2002 |
| Priority date | — |
| Expiry date | Aug 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprising: a semiconductor chip having plural electrode pads on one main surface thereof; a wiring board having plural connection parts; and plural salient electrodes disposed respectively between the electrode pads of the semiconductor chip and the connection parts of the wiring board to provide electrical connections between the two, the salient electrodes being arranged in an array not providing balance of the semiconductor chip with respect to one main surface of the wiring board, the plural connection parts of the wiring board being arranged at a deeper position than one main surface of the wiring board in a depth direction from the one main surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.