Electrical apparatus
US6493231B2 · kind B2 · utility
4Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1999 |
| Grant date | Dec 10, 2002 |
| Priority date | — |
| Expiry date | Jul 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/4602
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A housing for a microwave circuit is formed from a base made of metal matrix composite material and walls made of sheet metal. The base and the walls are joined together by diffusion soldering. Some holes to receive feedthroughs are formed at the junction of the base and a wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.