Method and apparatus to compliantly interconnect area grid arrays and printed wiring boards
US6493238B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Dec 10, 2002 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system of utilizing inexpensively manufactured, electrically conductive and mechanically compliant disks to interconnect an area grid array (“AGA”) chip to a printed wiring board. The conductive disk shaped leads are stamped from a thin sheet of conductive material. To increase solderability and protect the disk surface, the disks can be plated with tin or an equivalent material. Each disk is positioned tangent to the surface of an AGA chip in a specific orientation. One edge of each disk is electrically connected and mechanically secured to a corresponding conductive pad located on the surface of the AGA chip. The opposite edge of each conductive disk is positioned to align with a corresponding conductive surface pad on a printed wiring board (“PWB”). Each opposite edge is electrically connected and mechanically secured to the surface of the PWB, thereby establishing a compliant electrical connection between the AGA chip and the PWB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.