Method of making flexible electronic circuitry
US6493933B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Oct 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Stitchable electrical components have flexible, conductive leads and are encased, at least partially, in sealed packages. Conductive threads, yarns, or fiber bundles are patterned onto a flexible substrate (e.g., a textile panel). To form a circuit, the component leads are conductively stitched, spot welded, or otherwise joined to a textile panel so as to form connections between at least some of the stitched leads so as to form an electrical circuit. Alternatively, leads stitched into or otherwise joined to a textile pattern may be welded or otherwise permanently joined to flexible or non-flexible component leads to form a circuit. Multiple panels of circuitry so formed may then be physically and electrically joined at various locations by a combination of stitching, welding, and/or other joining means, preferably with interposed insulating layers, to form a multilayer flexible circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.