IC card having fingerprint sensor designed to withstand bending
US6494380B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 11, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jan 23, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG07C9/257
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip card comprising a card made from a plastics material (1) capable of elastically withstanding a relative bending and in which a microelectronic data processing chip (4) is encased, a thin microelectronic wafer (5) made from a semiconductor material, such as a finger print sensor, additionally being joined to the card (1). Said wafer (5) is sub-divided into a small number of juxtaposed chips (7) disposed in a given pattern and separated from one another by a predetermined distance (d) which is sufficient for each separating strip (8) of plastics material to be slightly bent without causing adjacent chips (7) to become unstuck and/or rupture; electrical links are established between the chips to provide electrical continuity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.