Solder-holding clips for applying solder to connectors or the like
US6494754B2 · kind B2 · utility
19Cited by
21References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2002 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jan 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.