Bonding of thermal tile insulation
US6494979B1 · kind B1 · utility
15Cited by
15References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jan 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/237
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An insulative body having first and second porous insulation members and a ceramic binder. Each of the first and second porous insulation members is formed of a fibrous, low-density silica-based material and cooperatively defines a joint. The ceramic binder is disposed between a pair of mating surfaces that form the joint. The ceramic binder couples the first and second porous insulation members together. A method for bonding insulative bodies to one another through the use of an ceramic/organic thermal setting binder is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.