Electrical circuit board and a method for making the same
US6495053B1 · kind B1 · utility
2Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jan 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.