Molding method for encapsulating a part
US6495082B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Feb 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/778
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus and method of use thereof. The molding apparatus has a stationary mold base, and at least one moveable mold core rotatable into and out of a facing relationship with the stationary mold base. When the moveable mold core is in its closed position, it cooperates with the stationary mold base to define a mold cavity. The mold base may be shaped so as to aid in forming a part, or to hold a sheet of material onto which molding material is to be deposited so as to encapsulate the part on one or more edges or surface regions. Structure may also be encapsulated onto the surface of the material during the molding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.