Molding material
US6495225B1 · kind B1 · utility
14Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1999 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Dec 17, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Molding materials comprising a cellulose based fiber, and a thermoplastic resin in an amount of less than said cellulose based resin is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.