Photopolymerizable resin compositions and use thereof
US6495298B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Nov 29, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/22
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention relates to a photopolymerizable resin composition containing resin component (A) composed of a resin and/or a resin-forming ingredient and a photopolymerization initiator (B) wherein the component (A) comprises an addition-polymerizable compound (A1) having at least two ethylenically unsaturated groups and the photopolymerization initiator (B) comprises a diaminobenzophenone compound (B1), an N-phenylglycine compound (B2), and at least one kind of compound selected from a group of a 3,3′,4,4′-tetra(alkylperoxycarbonyl)benzophenone (B3), 2-methyl-1-[4-(thiomethyl)phenyl]- 2-morpholinopropan-1-one (B4), and a 1,3,5-triazine derivative (B5) containing at least one trihalomethyl group as substituent. A photopolymerizable resin composition of this invention excels in resolution, adhesion of patterns, development latitude, and curing on the surface and inside and can be used advantageously in insulating films, colored films, inks for color filters, resists for semiconductors, and insulating spacers for touch panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.