Light-emitting semiconductor chip
US6495861B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 9, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Nov 9, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip-type semiconductor light-emitting device includes a substrate (2). An LED element (1) is mounted on a pad (3a) formed in one (3) of a pair of electrodes (3, 4) formed on the substrate (2). A reflector (6) is formed with an aperture (6c) defined by a slant surface (6Z) and opened to the outside to accommodate therein the LED element (1). Translucent resin is filled in the aperture (6c). The slant surface (6Z) has a plurality of reflection surfaces (P, Q) formed continuous thickness-wise of the reflector, which are selected in inclination angle relative to the substrate (2) such that light is reflected to the immediate upward at respective mid-slopes of the reflection surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.