Semiconductor clamped-stack assembly
US6495913B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jul 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled. The plate (14) is hooked into frame rods (1) belonging to the clamped-stack assembly (32) or guided in guide rails (18).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.