Computer chip heat protection apparatus
US6496118B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Sep 11, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Sep 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat protection apparatus includes a heat sink adapted for mounting to a computer chip for dissipating heat generated thereby, the heat sink having a base defining a channel peripherally thereabout. A cooling fan is mounted to the heat sink for dispersing the dissipated heat. The apparatus includes a logic circuit capable of evaluating resistance input data and capable of energizing an alarm upon a programmed condition. The apparatus includes a temperature sensitive polymeric tape spanning between a pair of conductors connected to the circuit. The conductors and polymeric tape are mounted in the channel. The circuit energizes the alarm if the resistance data indicates a temperature greater than a predetermined critical temperature parameter or if the data indicates a temperature rate of rise greater than a critical rate of rise parameter. The alarm may be audible or provide a visual indicator to a computer display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.