Heat sink fastener for an electronic device
US6496372B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Sep 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/42
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electronic assembly that includes an integrated circuit package, a heat sink, and a fastener which connects the heat sink to the integrated circuit package to cool the integrated circuit package. The fastener includes a stem that extends through the heat sink and the integrated circuit package. The fastener further includes a clamp that is connected to one end of the stem and a spring head that is connected to an opposing end of the stem. The spring head includes a first biasing member that extends around the longitudinal axis of the stem to compress the heat sink and the integrated circuit package against the clamp in order to reduce the thermal impedance between the heat sink and the integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.