Methods and apparatus for chemical mechanical planarization using a microreplicated surface
US6497613B1 · kind B1 · utility
3Cited by
29References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2000 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Nov 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for chemically and mechanically planarizing a workpiece surface employs a polishing slurry and a microreplicated pad having a surface for planarizing the workpiece surface in the presence of the slurry. The surface of the microreplicated pad has a regular array of structures having a sharp distal apexes which contact the workpiece surface during planarization and which are subject to ablating during planarizing thereby becoming substantially blunt. The workpiece moves in a rotational, orbital or translational motion relative to the microreplicated pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.