Method using a saw tooth mold
US6497837B2 · kind B2 · utility
3Cited by
14References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The method employs a device formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.