Method and apparatus for mounting printed circuit board components
US6498708B2 · kind B2 · utility
17Cited by
12References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1999 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for mounting heat generating components on a printed circuit board. Components mounted on the printed circuit board that generate heat may alter the properties of the printed circuit board and allow the printed circuit board to conduct current. To stop the flow of current in the printed circuit board, a slot may be used between the mounting points of the component. The slot prevents current from flowing within the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.