Method and two-phase spray cooling apparatus
US6498725B2 · kind B2 · utility
121Cited by
19References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | May 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A compact, lightweight, and efficient evaporative spray cooling system is provided for removing high heat fluxes from surfaces of devices such as micro-electronic chips, metal, mirrors, and lasers. The system uses expanding metastable two-phase flow and a method of controlling the spray for optimum heat flux removal. Control includes spray atomization, fluid-phase, mass flow, and spray temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.