Heat dissipation in electrical apparatus
US6498726B2 · kind B2 · utility
8Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2000 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Dec 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.