Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices
US6498899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Dec 22, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2862
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of controlling a temperature of a semiconductor device during testing is used with a system including a heater and a heat sink and a temperature control system. The semiconductor device is thermally coupled to the heater, which is thermally coupled to a heat sink. The heat sink defines a chamber, and the chamber is adapted to have a liquid flowing through the chamber. The temperature control system is coupled to the heater and the heat sink. In the method, the temperature of the semiconductor device is moved to approximately a first set point temperature. The temperature of the semiconductor device is moved to approximately a second set point temperature, from approximately the first set point temperature, by changing a temperature of the heater and maintaining the liquid flowing into the chamber at a substantially constant temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.