Method and device for applying sealant to component
US6500483B1 · kind B1 · utility
0Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Feb 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.