Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same
US6500535B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 26, 1998 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Aug 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31924
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.