Heat activatable adhesive composition and adhesive sheet having adhesive layer thereof
US6500536B1 · kind B1 · utility
29Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Sep 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heat activatable adhesive composition including a thermoplastic resin, and a hindered phenol compound which is solid at 20° C. and which is fusible at an elevated temperature. The adhesive composition is useful as a heat activatable adhesive layer of labels or sheets including a heat-sensitive recording label.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.