Halogen-free phosphorous-containing flame-resistant epoxy resin compositions
US6500546B1 · kind B1 · utility
5Cited by
0References
13Claims
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Key dates
| Filing date | Nov 1, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Nov 1, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Curable flame-resistant substantially halogen free epoxy resin compositions, comprising:(a) one or more bifunctional or polyfunctional epoxy resin;(b) a specific phosphorous-containing compound;(c) a curing agent consisting of oligomers of styrene and maleic acid and/or maleic anhydride and/or salts or esters of maleic acid;(d) a curing catalyst; and optionally;(e) additives;prepregs derived from said compositions and laminates derived from said prepregs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.