Semiconductor encapsulating epoxy resin composition and semiconductor device
US6500564B1 · kind B1 · utility
13Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Aug 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.