Very ultra thin conductor-layers for printed wiring boards
US6500566B1 · kind B1 · utility
6Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Nov 5, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for making a metal-clad laminate product including: providing a carrier film; depositing directly onto the carrier film a release agent layer, the release agent layer comprising an aqueous soluble polymer; forming a conductive metal layer on the release agent layer, the metal layer having a thickness of less than about 10,000 Angstroms; bonding the metal layer to a circuit board laminate layer; and removing the carrier film from the metal layer by peeling the carrier layer from the release agent layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.