Improving adhesion of acrylate resins

US6500878B1 · kind B1 · utility

Assignee

• BASF SE

Inventors

• Wolfgang Reich · Frankenthal (Pfalz), DE
• Peter Enenkel · Konstanz, DE
• Edmund Keil · Ludwigshafen, DE
• Matthias Lokai · Enkenbach-Alsenborn, DE
• Erich Beck · Ladenburg, DE
• Klaus Menzel · Berlin, DE

Key dates

• Filing date: Jul 18, 2000
• Grant date: Dec 31, 2002
• Expiry date: Jul 18, 2020

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/085
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

In a process for improving the adhesive strength of radiation-cured films of acrylate resins which comprise compounds having at least one amine group and at least one unsaturated acrylate group and, in particular, an amino-modified acrylate resin having a molecular weight Mn of at least 300, on substrates, the acrylate resins are admixed with amine-hardenable polyepoxides having an epoxide value of from 1 to 15 mol/kg such as polyglycidyl esters or polyglycidyl ethers. Preferred curable mixtures of amine-modified acrylate resins with polyepoxides have amine numbers of from 1 to 250 mg KOH/g and epoxide values of from 0.1 to 4 mol/kg. The mixtures applied as coating films to metal substrates or plastics substrates, in particular, are radiation-cured with, e.g., UV light and an at least partial amine hardening of the polyepoxide compounds in the mixture is conducted by thermal conditioning at, e.g., from 50 to 120° C.