Low viscosity thermally conductive compositions containing spherical thermally conductive particles
US6500891B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2001 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | May 8, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention discloses a thermally conductive adhesive composition that is useful for encapsulating electronic parts. More particularly, this invention provides adhesive compositions that have 90% of the alumina particles having an average diameter sufficiently low to maintain the particles in suspension. The thermally conductive compositions of the present invention have a low viscosity and excellent thermal conductivity properties. Also contemplated is an electronic part that is encapsulated with the inventive composition, an article of manufacture having a container with the inventive composition contained therein and a method of manufacturing the inventive thermally conductive adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.