Epoxy resin system
US6500912B1 · kind B1 · utility
8Cited by
35References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Sep 12, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable epoxy composition comprises an epoxy resin having at least 1.5 epoxy groups per molecule and an amine-terminated polyamide. The liquid amine-terminated polyamide is prepared by reacting a long-chain, C20-C60 dicarboxylic acid or derivative with an amine having a general formula of R1—NH—R2—NH—R3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.