Electrical circuit board and a method for making the same
US6501031B1 · kind B1 · utility
8Cited by
7References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Sep 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.