Laser-scribing brittle substrates
US6501047B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Nov 23, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser-scribing brittle substrates along a curvilinear path is effected by impinging and moving at least two laser light beam spots along the substrate surface, the first spot preheating the substrate and the second smaller spot heating the substrate to the laser-scribing temperature below the softening temperature of the substrate. Embodiments include forming dual spots employing a crystal material or employing dual fiber optic cables each optically linked to a lens. In another embodiment, three spot lasers spots are formed employing a three-spot diffractive lens, the third spot formed behind the second laser-scribing spot and heating the surface to a temperature lower than the laser-scribing temperature. Embodiments further include laser-scribing substantially circular glass, ceramic or glass-ceramic substrates for magnetic recording media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.