Hall effect sensor assembly with cavities for integrated capacitors
US6501270B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | May 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N52/80
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A Hall effect sensor and capacitor assembly includes leadless chip type capacitors employed as EMI shielding/ESD protection and bypass capacitors. In a first embodiment, a molded carrier structure provides a housing for mounting a Hall cell element as well as one or more EMI shielding or bypass capacitors. The carrier housing facilitates interconnection of the Hall cell and the chip capacitor. Additionally, this structure simplifies the manufacturing process for connection of the smaller leadless chip capacitor components. In an alternate embodiment, an insulated, molded encapsulation is applied and surrounds the chip capacitors and the connections to the Hall effect sensor leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.