Heat sink capable of having a fan mounted aslant to the lateral side thereof
US6501651B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2001 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Jan 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit. The fan is mounted aslant to the lateral side of the heat dissipation unit in the accommodating area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.