Structure of a ball grid array IC mounting seat
US6501665B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Aug 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved structure of a Ball Grid Array IC mounting seat is disclosed. The IC mounting sear is characterized in that the middle section of the elongated thin strap is provided with a notch such that when the thin strap is folded correspondingly, the folding is at the side wall of the notch and all regions of the side edge of the notch are curved to externally clip the clipping body of the ball edge of the solder ball and the solder ball is mounted to the bottom clipping body of the conductive plates, thereby the solder ball is secured. In application the pre-soldering of the solder ball onto the conductive clipping plate is avoided, and the production process is rapid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.