Patent · US Expired

Thermal insulation to be inserted between two insulating structures

US6501784B1 · kind B1 · utility

1Cited by
7References
28Claims
0Family size

Assignees

Inventors

Key dates

Filing dateMar 22, 2001
Grant dateDec 31, 2002
Priority date
Expiry dateMar 22, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/261
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

Disclosed is a thermal insulation to be inserted between two structures, surfaces, walls or the walls of components which are to be insulated. The thermal insulation consists of an plurality of hollow spheres made up by loose hollow spheres or by hollow spheres which are interconnected by sintered contacts. The ratio of the outer diameter of the hollow spheres to their wall thickness is 5 300. The hollow spheres are made of silicides, silicide composites, metals and intermetals and the alloys thereof, ceramics or glass. When the walls of the hollow spheres have a closed porous structure, the inner pressure in the hollow spheres is between 0 to 0.1 that of the surrounding air pressure at room temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.