Ink jet semiconductor chip structure
US6502926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2001 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Jan 30, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a printhead body having a chip surface side, an ink surface side opposite the chip surface side and a first coefficient of thermal expansion (CTE). A semiconductor chip containing ink ejector devices is adhesively attached to the chip surface side of the printhead body. A stiffener is adhesively attached to the ink surface side to provide body stiffening during curing of the adhesive. The semiconductor chip has a second CTE and the stiffener has a third CTE wherein the second and third CTE's have a similar value. The invention provides an improved structure for printheads which resist warpage and/or breakage of the semiconductor chips during the manufacturing process used to make the printheads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.