Centrifuge and method for centrifuging a semiconductor wafer

US6503335B2 · kind B2 · utility

Assignee

• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Georg-Friedrich Hohl · Altötting, DE
• Roland Brunner · Wien, AT
• Susanne Bauer-Mayer · Burghausen, DE
• Günther Brunner · Haiming, DE
• Hans-Joachim Luthe · Burgkirchen an der Alz, DE
• Franz Sollinger · Polling, DE

Key dates

• Filing date: Oct 26, 1999
• Grant date: Jan 7, 2003
• Expiry date: Oct 26, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S134/902
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A centrifuge for a semiconductor wafer has a centrifuge plate for holding a semiconductor wafer, has a drive for setting the centrifuge plate in rotation, and has a device for supplying a medium to a front side and a rear side of the semiconductor wafer. The centrifuge has a housing which separates a centrifuging area and the semiconductor wafer from the environment, and a device for generating a laminar gas flow in the housing. A method for centrifuging a semiconductor wafer has the semiconductor wafer being centrifuged in a laminar gas flow.