Use of a cleaning process, a cleaning process, a connection process and a workpiece pair
US6503351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Dec 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/338
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method uses a treatment process for surfaces which subsequently are to be connected by bonding, gluing or molding. The surfaces are exposed to an atmosphere with activated hydrogen. The connection is made a process step for eliminating the conservation treatment. The surfaces can be subjected to a plasma discharge in an atmosphere containing hydrogen. The plasma discharge is operated by a cathode/anode path as a DC discharge, and using a thermionic cathode as the cathode. The workpiece to be stored in air comprises a connection, which by gluing, bonding or molding, is subjectable to substantially higher stress than an identical workpiece which is stored in an identical manner, this being determinable by essentially identical Auger diagrams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.