Coating method and apparatus with substrate extension device
US6503571B1 · kind B1 · utility
2Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2001 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Jul 11, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G5/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating method for a hollow substrate including: (a) forming a seamed extended substrate unit composed of a substrate extension device and the substrate, and employing a chuck assembly to internally grip the substrate; (b) dip coating the extended substrate unit while the chuck assembly internally grips the substrate to deposit a layer first on the substrate extension device and then on the substrate; and (c) separating, subsequent to the dip coating the extended substrate unit, the substrate extension device from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.