Semiconductor device with dummy wiring layers
US6504254B2 · kind B2 · utility
15Cited by
9References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device 100 has wiring layers 20a and 20b and a plurality dummy wiring sections 30 provided at the same level where the wiring layers 20a and 20b are formed. The dummy wiring sections 30 have at least one through hole 32.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.