Field emitting device comprising metallized nanostructures and method for making the same
US6504292B1 · kind B1 · utility
143Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1999 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Jul 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/939
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, an improved conductive nanostructure assembly comprises an array of metallized nanostructures disposed on a conductive substrate. The substrate can also be metallized. Such assemblies provide continuous electron transport from the substrate to the tips of the nanostructures. Several ways of making such assemblies are described along with several devices employing the assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.