Non-incandescent lightbulb package using light emitting diodes
US6504301B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 1999 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Sep 3, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED package and a method of fabricating the LED package utilize a prefabricated fluorescent member that contains a fluorescent material that can be separately tested for optical properties before assembly to ensure the proper performance of the LED package with respect to the color of the output light. The LED package includes one or more LED dies that operate as the light source of the package. Preferably, the fluorescent material included in the prefabricated fluorescent member and the LED dies of the LED package are selectively chosen, so that output light generated by the LED package duplicates natural white light. In a first embodiment of the invention, the prefabricated fluorescent member is a substantially planar plate having a disk-like shape. In a second embodiment, the prefabricated fluorescent member is a non-planar disk that conforms to and is attached to the inner surface of a concave lens. In this embodiment, the optical properties of the fluorescent member are tested by examining an integrated unit formed by the concave lens and the attached fluorescent member. In both embodiments, the LED package includes a layer of encapsulant material that is deposited between …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.