Multi-level thermal management system and method
US6504714B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 16, 2000 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Aug 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-level thermal management system and method are provided for cooling a plurality of vertically spaced electrical components, including a lower electrical component and an upper electrical component. The system includes a rigid support securing the upper electrical component in a fixed position above the lower electrical component. A duct, having an upper end and a lower end, an inlet defined in the lower end of the duct and an outlet defined in the upper end of the duct, is mounted adjacent to the upper electrical component with the inlet being located above the lower electrical component to direct air heated by the lower electrical component through the duct without substantially contacting the upper electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.