Analyzing thermal characteristics of geometries
US6505326B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Dec 26, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method for analyzing a baseline geometry and, optionally, a modified geometry. The method can include generating a numerical representation of a baseline geometry having baseline elements identified with first identifiers or element identifiers, and then assigning second identifiers or analyzer identifiers to the elements. Thermal characteristics of the geometry are analyzed with reference to the second or analyzer identifiers. The results of the thermal analysis can be provided as an input for a structural analysis of the baseline geometry. At least one of the elements of the geometry can then be altered in a manner that at least partially automatically adjusts the surrounding geometry, and the same first identifier or element identifier is associated with the altered element as was associated with the baseline, unaltered element. The altered geometry can be analyzed with respect to a third identifier (or another analyzer identifier) and a correspondence between the identifiers, the baseline element, and the altered element can be established and maintained. Accordingly, the boundary conditions and/or the mesh applied to the baseline geometry can be automatically appl…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.